{"title":"小电流软故障的EBIRCH定位","authors":"Gregory M. Johnson, A. Rummel","doi":"10.31399/asm.cp.istfa2021p0253","DOIUrl":null,"url":null,"abstract":"An experimental study was undertaken to determine the minimum level of leakage or shorting current could be detected by EBIRCH. A 22 nm SRAM array was overstressed with a series gradually increasing bias, followed by EBIRCH scans with 1 V applied bias and 2 kV SEM imaging, until fins were observed. The result was that with only 12 nA of shorting current, the fins of a pulldown device could be imaged by EBIRCH. Higher stresses created an ohmic short, and careful consideration of experiments with current direction provide additional evidence that EBIRCH is largely a temperaturedriven, or Seebeck effect.","PeriodicalId":188323,"journal":{"name":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"EBIRCH Localization for Low-Current Soft Fails\",\"authors\":\"Gregory M. Johnson, A. Rummel\",\"doi\":\"10.31399/asm.cp.istfa2021p0253\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An experimental study was undertaken to determine the minimum level of leakage or shorting current could be detected by EBIRCH. A 22 nm SRAM array was overstressed with a series gradually increasing bias, followed by EBIRCH scans with 1 V applied bias and 2 kV SEM imaging, until fins were observed. The result was that with only 12 nA of shorting current, the fins of a pulldown device could be imaged by EBIRCH. Higher stresses created an ohmic short, and careful consideration of experiments with current direction provide additional evidence that EBIRCH is largely a temperaturedriven, or Seebeck effect.\",\"PeriodicalId\":188323,\"journal\":{\"name\":\"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.cp.istfa2021p0253\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2021p0253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An experimental study was undertaken to determine the minimum level of leakage or shorting current could be detected by EBIRCH. A 22 nm SRAM array was overstressed with a series gradually increasing bias, followed by EBIRCH scans with 1 V applied bias and 2 kV SEM imaging, until fins were observed. The result was that with only 12 nA of shorting current, the fins of a pulldown device could be imaged by EBIRCH. Higher stresses created an ohmic short, and careful consideration of experiments with current direction provide additional evidence that EBIRCH is largely a temperaturedriven, or Seebeck effect.