卫星热红外成像微辐射热计探测器阵列

T. Pope, C. Alain, A. Bergeron, H. Jerominek, O. Saint-Pé, I. Zayer, J. Bézy
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引用次数: 6

摘要

基于微机械热测量探测器的红外成像阵列正在开发中。该阵列旨在满足基于卫星的红外成像和探测应用的要求,包括云和地表温度监测以及森林火灾监测。它的设计使它也适用于地面光谱和中速成像应用。该阵列由3条平行线组成,间距为39µm,像素为512。每个像素都包括主动和参考探测器,以减少像素到像素的偏移变化,消除共模偏置噪声,并提供更高的抗芯片温度漂移能力。构成有源探测器结构的薄膜被设计为在8.3到13µm之间提供高而均匀的红外吸收。使用表面微机械后处理方法,在定制CMOS读出集成电路(ROIC)上单片制造像素。先进的ROIC采用开关电容相关双采样积分器将所有像素的信号并行集成,并进行片上模拟到数字的转换。尽管像素尺寸小,但f/1光学元件在8-12µm波段的投影热分辨率低于50 mK。在本文中,我们将描述探测器阵列的设计并给出初步测试结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microbolometer Detector Array for Satellite-Based Thermal Infrared Imaging
An infrared imaging array based on micromachined bolometric detectors is under development. The array is designed to meet the requirements of satellite-based infrared imaging and detection applications, including cloud and earth surface temperature monitoring and forest fire monitoring. Its design makes it also suitable for terrestrial spectrometric and moderate speed imaging applications. The array consists of three parallel lines of 512 pixels on a 39 µm pitch. Each pixel includes both active and reference detectors to reduce pixel to pixel offset variation, eliminate common mode bias noise, and provide increased immunity to die temperature drift. The thin films making up the active detector structure are designed to provide high and uniform infrared absorption between 8.3 and 13 µm. The pixels are fabricated monolithically over a custom CMOS readout integrated circuit (ROIC) using a surface micromachined post-processing approach. The advanced ROIC integrates the signals of all pixels in parallel using switched capacitor correlated double sampling integrators and performs on-chip analog to digital conversion. Despite the small pixel size the projected thermal resolution over the 8-12 µm spectral band for f/1 optics is below 50 mK. In this paper we will describe the detector array design and present preliminary test results.
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