基于三维封装的CAN总线通信系统设计

2018 10th International Conference on Communications, Circuits and Systems (ICCCAS) Pub Date : 2018-12-01 DOI:10.1109/ICCCAS.2018.8768966

Yang Fan, Yang Chao, Xu Zhen, Tang Keran, Pang Youbing, Zhang Tianxing

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引用次数: 0

摘要

提出了一种基于三维封装的小型化隔离型CAN总线通信系统电路。该电路采用先进的堆叠式3D封装技术，将CAN总线控制器、隔离器、CAN总线收发器、晶体振荡器、电源管理等器件埋入三块PCB板中，形成15mm*15mm*4mm的SIP封装。与市场上的一般器件相比，电路体积缩小了2/3。

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Design of a CAN Bus Communication System Based on 3D Package

A Miniaturization and Isolation CAN Bus communication system circuit based on 3D package is presented in this paper. This circuit brings the advanced stacked 3D package technology to makes the CAN BUS Controller, Isolator, CAN BUS Transceiver, Crystal Oscillator, Power Management and so on to bury in three PCB board, and forms the SIP package of 15mm*15mm*4mm. Compared with the general devices on the market, the circuit volume is reduced by 2/3.

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2018 10th International Conference on Communications, Circuits and Systems (ICCCAS)

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