非冷却微辐射热计成像仪片上过热保护方案

Dahe Liu, Xueyou Shi, Guangyi Chen, Wengao Lu, Zhongjian Chen
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引用次数: 0

摘要

微辐射热计传感器的焦耳热效应使元件在读出过程中迅速加热,长时间加热可能对探测器造成永久性损坏。为了解决这一问题,我们提出了一种基于模拟行选择时间长度检测电路的自保护方案。该保护电路对各种序列误差有效,提高了整个检测器的鲁棒性。通过实现具有微调边缘延迟的级联or门逻辑,行级选择电路的布局更规则,面积更小。为了验证所提出的方案,在0.18$\mu$m CMOS工艺下设计并制作了像素间距为17$\mu$m的640$\times$512阵列格式非冷却红外探测器。电路功耗低于50$\mu$W,测量的行周期保护阈值在360$\mu$s左右。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On-Chip Excessive Heating Protection Scheme for Uncooled Micro-Bolometer Imagers
Joule heating effect of micro-bolometer sensors heats the elements rapidly during readout, and longtime heating might cause permanent damage of the detector. To solve this problem, we proposed a self-protection scheme based on an analog row select length of time detection circuitry. The protection circuit is effective for various sequential errors and improves the robustness of the whole detector. By implementing a cascaded OR-gate logic with trimmed edge delay, the row-level selection circuit layout is more regular with reduced area. To verify the proposed scheme, a 640$\times$512 array format uncooled infrared detector with 17$\mu$m pixel pitch is designed and fabricated in 0.18$\mu$m CMOS process. Power consumption of the circuits is below 50$\mu$W and the measured protection threshold of row period is around 360$\mu$s.
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