基于黑硅的SOI无焊料倒装技术的概念

3rd IEEE International Conference on Group IV Photonics, 2006. Pub Date : 2006-10-09 DOI:10.1109/GROUP4.2006.1708209

M. Schnarrenberger, L. Zimmermann, T. Mitze, K. Voigt, J. Bruns, K. Petermann

{"title":"基于黑硅的SOI无焊料倒装技术的概念","authors":"M. Schnarrenberger, L. Zimmermann, T. Mitze, K. Voigt, J. Bruns, K. Petermann","doi":"10.1109/GROUP4.2006.1708209","DOIUrl":null,"url":null,"abstract":"Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact","PeriodicalId":342599,"journal":{"name":"3rd IEEE International Conference on Group IV Photonics, 2006.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon\",\"authors\":\"M. Schnarrenberger, L. Zimmermann, T. Mitze, K. Voigt, J. Bruns, K. Petermann\",\"doi\":\"10.1109/GROUP4.2006.1708209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact\",\"PeriodicalId\":342599,\"journal\":{\"name\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GROUP4.2006.1708209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"3rd IEEE International Conference on Group IV Photonics, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2006.1708209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在SOI板上定义黑硅区域，并覆盖一层粘附层。待安装设备的触点被推向这些区域，以建立机械、电气和热接触

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon

Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

3rd IEEE International Conference on Group IV Photonics, 2006.

自引率

0.00%

发文量