{"title":"多千瓦电力电子变流器集成技术与性能评价","authors":"I. Hofsajer, J. Ferreira, J. V. van Wyk, M. Smit","doi":"10.1109/IECON.1993.338982","DOIUrl":null,"url":null,"abstract":"This paper presents an overview of the current state of the technology for electromagnetic integration of high power electronic converters. Some of the materials technologies needed for manufacture are described. As an example a completely integrated experimental multi-kilowatt resonant DC-DC power converter is discussed, together with some problems encountered and their solution. Experimental results are also given. A possible extension of the technology to hard switched, but snubbed and clamped power converters is discussed. Some of the thermal problems together with a thermal analysis are addressed. Conclusions about the technology are drawn and possible future developments investigated.<<ETX>>","PeriodicalId":132101,"journal":{"name":"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Integrated technology and performance for multi-kilowatt power electronic converters-an evaluation\",\"authors\":\"I. Hofsajer, J. Ferreira, J. V. van Wyk, M. Smit\",\"doi\":\"10.1109/IECON.1993.338982\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an overview of the current state of the technology for electromagnetic integration of high power electronic converters. Some of the materials technologies needed for manufacture are described. As an example a completely integrated experimental multi-kilowatt resonant DC-DC power converter is discussed, together with some problems encountered and their solution. Experimental results are also given. A possible extension of the technology to hard switched, but snubbed and clamped power converters is discussed. Some of the thermal problems together with a thermal analysis are addressed. Conclusions about the technology are drawn and possible future developments investigated.<<ETX>>\",\"PeriodicalId\":132101,\"journal\":{\"name\":\"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON.1993.338982\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON.1993.338982","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated technology and performance for multi-kilowatt power electronic converters-an evaluation
This paper presents an overview of the current state of the technology for electromagnetic integration of high power electronic converters. Some of the materials technologies needed for manufacture are described. As an example a completely integrated experimental multi-kilowatt resonant DC-DC power converter is discussed, together with some problems encountered and their solution. Experimental results are also given. A possible extension of the technology to hard switched, but snubbed and clamped power converters is discussed. Some of the thermal problems together with a thermal analysis are addressed. Conclusions about the technology are drawn and possible future developments investigated.<>