M. Thompson, Brad Ferguson, G. Nielson, S. Schultz
{"title":"碳化硅晶圆的加工","authors":"M. Thompson, Brad Ferguson, G. Nielson, S. Schultz","doi":"10.1109/ietc54973.2022.9796914","DOIUrl":null,"url":null,"abstract":"Silicon carbide has many desirable properties that make it a high demand product. Some of these properties make it difficult to machine silicon carbide for industrial use. This work demonstrated the ability to machine silicon carbide using Electrical Discharge Machining, Water Jet Machining, and diamond grinding.","PeriodicalId":251518,"journal":{"name":"2022 Intermountain Engineering, Technology and Computing (IETC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Machining of Silicon Carbide Wafers\",\"authors\":\"M. Thompson, Brad Ferguson, G. Nielson, S. Schultz\",\"doi\":\"10.1109/ietc54973.2022.9796914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Silicon carbide has many desirable properties that make it a high demand product. Some of these properties make it difficult to machine silicon carbide for industrial use. This work demonstrated the ability to machine silicon carbide using Electrical Discharge Machining, Water Jet Machining, and diamond grinding.\",\"PeriodicalId\":251518,\"journal\":{\"name\":\"2022 Intermountain Engineering, Technology and Computing (IETC)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 Intermountain Engineering, Technology and Computing (IETC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ietc54973.2022.9796914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 Intermountain Engineering, Technology and Computing (IETC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ietc54973.2022.9796914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon carbide has many desirable properties that make it a high demand product. Some of these properties make it difficult to machine silicon carbide for industrial use. This work demonstrated the ability to machine silicon carbide using Electrical Discharge Machining, Water Jet Machining, and diamond grinding.
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