商用GaAs集成电路元件的低成本封装技术

GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996 Pub Date : 1996-11-03 DOI:10.1109/GAAS.1996.567628

V. Steel

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引用次数: 0

摘要

功率放大器等GaAs IC组件的商业封装需要特别注意，以确保适当的热管理，同时保持低成本。研究了几种类型的封装的电气和热性能。还讨论了采用各种塑料封装的集成电路的一些实例。

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Low cost packaging techniques for commercial GaAs IC components

Commercial packaging of GaAs IC components such as Power Amplifiers requires special care to ensure proper thermal management while maintaining low cost. Several types of packages are investigated for electrical and thermal performance. Some examples of ICs which utilize various types of plastic packages are also discussed.

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GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996

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