温度对纳米片TFET直流性能的影响

G. Jain, R. Sawhney, Ravinder Kumar
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引用次数: 0

摘要

本文对垂直堆叠纳米片场效应晶体管(VSN-FET)和垂直堆叠纳米片隧道场效应晶体管(VSN-TFET)进行了对比分析。VSN-FET掺杂N-I-N,而VSN-FET采用P-I-N结构。与VSN-FET的OFF电流(4.53E-11A)相比,VSN-FET的漏电流减少了1.17E-16A。VSN-FET的开关比为9.38E+11,令人难以置信,而VSN-FET的开关比为8.05E+06。与VSN-FET相比,VSN-FET的亚阈值摆幅(SSw)改善了69.43%。此外,还进行了VSN-TFET的温度评估。该装置的性能在200到400开尔文的温度范围内进行了测试。结果表明,导通电流的温度依赖性很小,但在关断状态域温度依赖性上升。分析了温度对亚阈值摆幅、DIBL和总栅极电容的影响。所有的仿真都是使用visualtcad工具进行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of temperature on the DC performance of Nanosheet TFET
In this article, a comparative analysis of vertically stacked nanosheet field effect transistor (VSN-FET) with vertically stacked nanosheet tunnel field effect transistor (VSN-TFET) is done. VSN-FET is doped with N-I-N, while VSN-TFET uses a P-I-N configuration. VSN-TFET has a reduced leakage current of 1.17E-16A compared to VSN-FET's OFF current (4.53E-11A). VSN-TFET has an incredible switching ratio of 9.38E+11, while VSN-FET possesses a meagre switching ratio of 8.05E+06. The VSN-TFET structure ameliorates subthreshold swing (SSw) by 69.43 percent compared to the VSN-FET. Additionally, the temperature evaluation of the VSN-TFET is performed. The device's performance is examined at temperatures ranging from 200 to 400 kelvin. The results demonstrate that the temperature dependency of ON-current is minimal, but it rises in the OFF-state domain. The effect of temperature on subthreshold swing, DIBL, and total gate capacitance has been analysed. All the simulations have been carried out using the Visual TCAD tool.
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