{"title":"新一代T/R模块技术","authors":"M. Rosker","doi":"10.1109/RADAR.2007.374346","DOIUrl":null,"url":null,"abstract":"Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications (WBGS-RF) program, the Scalable Millimeter Wave Architectures for Reconfigurable Transceivers (SMART) program, the Integrated Sensor Is Structure Critical Technology Demonstration (ISIS-CTD), and the Sub-millimeter Wave Imaging Focal-plane Technology (SWIFT) program.","PeriodicalId":367078,"journal":{"name":"2007 IEEE Radar Conference","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Technologies for Next Generation T/R Modules\",\"authors\":\"M. Rosker\",\"doi\":\"10.1109/RADAR.2007.374346\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications (WBGS-RF) program, the Scalable Millimeter Wave Architectures for Reconfigurable Transceivers (SMART) program, the Integrated Sensor Is Structure Critical Technology Demonstration (ISIS-CTD), and the Sub-millimeter Wave Imaging Focal-plane Technology (SWIFT) program.\",\"PeriodicalId\":367078,\"journal\":{\"name\":\"2007 IEEE Radar Conference\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Radar Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RADAR.2007.374346\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Radar Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RADAR.2007.374346","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications (WBGS-RF) program, the Scalable Millimeter Wave Architectures for Reconfigurable Transceivers (SMART) program, the Integrated Sensor Is Structure Critical Technology Demonstration (ISIS-CTD), and the Sub-millimeter Wave Imaging Focal-plane Technology (SWIFT) program.