基于性能和物理约束的多芯片模块系统分区新方法

Y. Katsura, T. Koide, S. Wakabayashi, N. Yoshida
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引用次数: 4

摘要

在本文中,我们提出了一种新的和第一个考虑芯片间延迟、芯片面积和I/O引脚限制的MCM系统划分方法。该方法包括两个步骤,即考虑三个约束条件的聚类步骤和基于数学规划的迭代改进步骤。在第一步中,我们采用两种聚类算法,考虑这三种约束条件,减小大型MCM系统分区问题的规模,从而在实际的计算时间内得到解决方案。接下来,它使用0-1整数线性规划(ILP)生成一个初始分区,以便最小化总导线长度。由于初始解中可能存在违反约束的情况,在第二步中,我们将划分问题表述为选择一个最大独立集的LP问题,并对其进行改进,直到切割总数不减少且满足三个约束。我们还展示了可以通过删除冗余的定时约束来减少定时约束的数量。实验结果表明,与仅考虑两个约束的传统方法[15]相比,该方法能够生成满足三个约束的分区,切割次数平均提高27%,最大提高30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new system partitioning method under performance and physical constraints for multi-chip modules
In this paper, we propose a new and the first MCM system partitioning method considering chip-to-chip delays, chip areas and I/O pins constraints. The proposed method consists of two steps, a clustering step considering the three constraints and an iterative improvement step with mathematical programming. In the first step, we apply two clustering algorithms considering the three constraints and reduce the size of the large MCM system partitioning problem so as to get a solution within a practical computation time. Next, it generates an initial partitioning with 0-1 integer linear programming (ILP) so as to minimize the total wire length. Since there may exist constraint violations in the initial solution, in the second step, we formulate the partitioning problem as a LP problem selecting a maximal independent set and improve it until the total number of cuts is not decreased and the three constraints are satisfied. We also showed that the number of the timing constraints can be reduced by deleting redundant timing constraints. Experimental results showed that the proposed method is able to produce partitions satisfying the three constraints and improves the number of cuts by a 27% on an average and a 30% in maximum over the conventional method [15] considering only two constrains.
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