O. Rits, R. Bockstaele, M. De Wilde, W. Meeus, H. Sergeant, J. De Baets, J. V. Van Campenhout, R. Baets, F. Dorgeuille, S. Eitel, M. Klemenc, R. Annen, J. Van Koetsem, J. Goudeau, B. Bareel, F. Marion, J. Routin
{"title":"CMOS集成电路之间的二维光互连","authors":"O. Rits, R. Bockstaele, M. De Wilde, W. Meeus, H. Sergeant, J. De Baets, J. V. Van Campenhout, R. Baets, F. Dorgeuille, S. Eitel, M. Klemenc, R. Annen, J. Van Koetsem, J. Goudeau, B. Bareel, F. Marion, J. Routin","doi":"10.1364/IP.2005.ITHA1","DOIUrl":null,"url":null,"abstract":"We describe an optical interconnect demonstrator in which 2D fiber ribbons directly interconnect digital CMOS ICs with flip-chip mounted VCSEL and detector arrays. Novel approaches are demonstrated for the optical interface to the CMOS package.","PeriodicalId":212240,"journal":{"name":"2005 OSA Topical Meeting on Information Photonics (IP)","volume":"5 7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"2D optical interconnects between CMOS ICs\",\"authors\":\"O. Rits, R. Bockstaele, M. De Wilde, W. Meeus, H. Sergeant, J. De Baets, J. V. Van Campenhout, R. Baets, F. Dorgeuille, S. Eitel, M. Klemenc, R. Annen, J. Van Koetsem, J. Goudeau, B. Bareel, F. Marion, J. Routin\",\"doi\":\"10.1364/IP.2005.ITHA1\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We describe an optical interconnect demonstrator in which 2D fiber ribbons directly interconnect digital CMOS ICs with flip-chip mounted VCSEL and detector arrays. Novel approaches are demonstrated for the optical interface to the CMOS package.\",\"PeriodicalId\":212240,\"journal\":{\"name\":\"2005 OSA Topical Meeting on Information Photonics (IP)\",\"volume\":\"5 7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 OSA Topical Meeting on Information Photonics (IP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/IP.2005.ITHA1\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 OSA Topical Meeting on Information Photonics (IP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/IP.2005.ITHA1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We describe an optical interconnect demonstrator in which 2D fiber ribbons directly interconnect digital CMOS ICs with flip-chip mounted VCSEL and detector arrays. Novel approaches are demonstrated for the optical interface to the CMOS package.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
