Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications

Three-dimensional (3D) integration and interposer technology provide a promising solution for the continued minimization of modern electronic system. In this paper, through-glass-via (TGV) technique is used to form an ultra-compact bandpass filter (BPF). The proposed BPF is fully composed of well-designed TGV -based 3D array capacitors and 3D spiral inductors, and corresponding redistribution layers (RDL). A TGV-based shielding ring is utilized, which enhances the anti-interference property of the BPF, and also improves its thermal dissipation capability. The central frequency (f0) of the BPF is near 5 GHz, and the insertion loss and return loss are 2.25 dB and 15.8 dB, respectively. Moreover, the device footprint is only 0.91 × 0.58 mm2even including the shielding ring. A feasible fabrication flow is also proposed for the BPF, showing the optimization on process complexity and fabrication cost. The BPF is promising for the minimization of future 5G applications and system integration.