{"title":"边界扫描测试与电源电流监测相结合","authors":"M. Kärkkäinen, Kari Tiensyrjä, Matti Weissenfelt","doi":"10.1109/EDTC.1994.326872","DOIUrl":null,"url":null,"abstract":"The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture.<<ETX>>","PeriodicalId":244297,"journal":{"name":"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Boundary scan testing combined with power supply current monitoring\",\"authors\":\"M. Kärkkäinen, Kari Tiensyrjä, Matti Weissenfelt\",\"doi\":\"10.1109/EDTC.1994.326872\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture.<<ETX>>\",\"PeriodicalId\":244297,\"journal\":{\"name\":\"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-02-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTC.1994.326872\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTC.1994.326872","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Boundary scan testing combined with power supply current monitoring
The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture.<>
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