电子设备中的ESD:耦合机制和符合性测试

R. De Leo, G. Cerri, V. M. Primiani
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引用次数: 3

摘要

本文分析了静电放电对电子设备产生影响的几种途径。特别地,它们被分为直接耦合机制和间接耦合机制,也遵循一致性测试的标准规则。当放电发生在设备外壳或电缆上,穿透屏蔽,导致PCB走线和组件上的ESD电流时,就会出现直接耦合。另一方面,远距离ESD通过其强烈的辐射场产生间接耦合,从而冲击设备。特别危险的是那些发生在屏蔽外壳内部的放电:在这种情况下,辐射场直接与内部电子器件耦合,并通过外壳本身的谐振行为得到增强。每一种情况都得到了处理。从理论的角度来看,采用更有效的技术:电路方法,频率或时域数值方法,以及混合技术。所有的模拟都得到了实验验证,显示出令人满意的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ESD in electronic equipment: coupling mechanisms and compliance testing
The paper analyses several ways for an electrostatic discharge (ESD) to produce an effect on electronic equipment. In particular, they are classified into direct and indirect coupling mechanisms, also following the standard rules for compliance testing. A direct coupling arises when the discharge occurs on the equipment enclosure or on cables, that penetrating the shield, lead the ESD current on PCB traces and components. On the other hand, a distant ESD produces an indirect coupling by its strong radiated field, which impinges on the equipment. Particularly dangerous are those discharges occurring inside the shielding enclosure: in this case the radiated field directly couples with the internal electronics, and is enhanced by the resonant behaviour of the enclosure itself. Each situation is treated. from a theoretical point of view, adopting the more efficient technique: circuital approach, frequency or time domain numerical methods, and hybrid techniques. All simulations are experimentally confirmed showing a satisfactory agreement.
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