{"title":"21世纪高级设计的倒装芯片组装","authors":"Y. Lee, Q. Tan","doi":"10.1109/MSE.1997.612583","DOIUrl":null,"url":null,"abstract":"A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology.","PeriodicalId":120048,"journal":{"name":"Proceedings of International Conference on Microelectronic Systems Education","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1997-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Flip-chip assembly for senior designs in the 21/sup st/ century\",\"authors\":\"Y. Lee, Q. Tan\",\"doi\":\"10.1109/MSE.1997.612583\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology.\",\"PeriodicalId\":120048,\"journal\":{\"name\":\"Proceedings of International Conference on Microelectronic Systems Education\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-07-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Conference on Microelectronic Systems Education\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MSE.1997.612583\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Conference on Microelectronic Systems Education","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MSE.1997.612583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Flip-chip assembly for senior designs in the 21/sup st/ century
A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology.
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