含EBG元件的介电衬底缝隙波导的传输损耗分析

Y. Kimura, Toshiki Kajie, S. Saito
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引用次数: 0

摘要

本文研究了含EBG元件的介质衬底缝隙波导的传输损耗特性。所提出的缝隙波导由顶部导体板、底部具有蘑菇状EBG元件的介电衬底和它们之间的空气层组成。EBG元件可以防止空气层缝隙波导的泄漏,并且可以用PCB工艺经济有效地制造。利用ANSYS HFSS软件对间隙波导在4.7 GHz频段的传输损耗进行了数值模拟分析。仿真结果表明,与具有相同介质衬底的微带线相比,EBG元件间距大、脊线宽度大、空气层高度小的情况下,缝隙波导的传输损耗小于1 dB/m。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analyses of Transmission Loss of a Gap Waveguide Composed of a Dielectric Substrate with EBG Elements
This paper presents transmission loss characteristics of a gap waveguide composed of a dielectric substrate with EBG elements. The proposed gap waveguide consists of a top conductor plate, a bottom dielectric substrate with mushroom-like EBG elements, and an air layer between them. EBG elements prevent a leakage from the gap waveguide in the air layer and can be manufactured cost-effectively with PCB processes. Transmission loss of the gap waveguide is analyzed by numerical simulation with ANSYS HFSS at 4.7 GHz. It reveals by the simulation that smaller transmission loss of the gap waveguide of less than 1 dB/m is obtained for the cases of a large distance of the EBG elements, a large width of the ridge conductor, and a small height of the air layer in comparison with a microstrip line with the same dielectric substrate.
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