三栅极SOI-FinFET闪存的实验研究

Y. Liu, T. Kamei, T. Matsukawa, K. Endo, S. O'Uchi, J. Tsukada, H. Yamauchi, Y. Ishikawa, T. Hayashida, K. Sakamoto, A. Ogura, M. Masahara
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引用次数: 3

摘要

实验证实,TG型SOI-FinFET快闪存储器比DG型快闪存储器具有更小的Vt变化、更好的SCE免疫和更大的记忆窗口。在分栅FinFET闪存中证实了高度抑制的过擦除。在FG上引入薄的热氧化层有助于提高IPD层的质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental study of tri-gate SOI-FinFET flash memory
It was experimentally confirmed that smaller Vt variations, better SCE immunity and a large memory window are obtained in the TG type SOI-FinFET flash memories than the DG type ones. The highly suppressed over erase was confirmed in the split-gate FinFET flash memories. Introducing a thin thermal oxide layer on the FG is useful to improve the IPD layer quality.
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