平面包装中固化引起的应力和翘曲的分析估计

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765777

K. Jansen, J. de Vreugd, L. Ernst

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引用次数: 6

摘要

扁平包装的翘曲部分是由于成型化合物在固化期间的化学收缩，部分是由于随后冷却阶段的热收缩差异。后一种效应在数值模拟中比较容易考虑，但固化引起的收缩效应不容易考虑，因此在翘曲模拟中经常被忽略。然而，最近的验证研究表明，必须考虑到这两种影响。

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Analytical estimate for cure-induced stresses and warpage in flat packages

Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed that it is essential that both effects are taken into account.

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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