使用70纳米InP hemt的2至92 GHz分布式放大器

Yihu Li, W. Goh, Y. Xiong
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引用次数: 3

摘要

提出了一种宽带分布式放大器(DA)。放大单元采用晶体管尺寸不匹配的级联结构。使用不同尺寸的晶体管,输入和输出电容将更加平衡,从而为设计的数模提供更好的阻抗匹配。采用70 nm的InP hemt来制造所提出的设计,包括键合垫在内的总芯片面积为2.9mm×0.85mm。可实现2 ~ 82 GHz的频带宽度,平均增益为21 dB。电源电压为2v时,DA的总功耗为300mw。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 2 to 92 GHz distributed amplifier using 70-nm InP HEMTs
This paper presents a broad band distributed amplifier (DA). The amplifying cell utilizes the cascode structure with transistor dimension mismatch. With different sizes of the transistor used, the input and output capacitance will be more balanced and hence, better impedance matching is achieved for the designed DA. 70 nm InP HEMTs are used to fabricate the proposed design, the total chip area occupied is 2.9mm×0.85mm including the bonding pads. The DA achieves a band width of 2 to 82 GHz, with the average gain of 21 dB. The total power consumption of the DA is 300 mW with a power supply voltage of 2 V.
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