基于GaN hemt的移相全桥dc-dc变换器分析

Dongmyoung Joo, Byoung-Kuk Lee, Dongsik Kim, Jong-Soo Kim, Heejun Kim
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引用次数: 1

摘要

本文分析了氮化镓高电子迁移率晶体管在功率转换系统中的应用问题。与最先进的超级结Si(硅)MOSFET(金属氧化物半导体场效应晶体管)相比,FOM(品质图)由于异质结结构和宽带隙特性而要好得多。然而,由于GaN HEMT的阈值电压敏感,设计功率转换系统非常困难。寄生电容非常小,由于dv/dt和di/dt的陡峭以及与MOSFET不同的设计因子,使得设计更加困难。本文分析了实现电源和栅极驱动回路寄生电感影响的印刷电路板布局考虑。此外,从数学上分析了零电压开关失效的原因,即死区不匹配。设计了一个600w移相全桥dc-dc变换器,以评估寄生电感和ZVS失效问题的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of GaN HEMT-based phase shifted full bridge dc-dc converter
This paper presents the analysis of problem as to when the GaN HEMT (Gallium nitride high electron mobility transistor) is applied to power conversion system. Compared to state-of-the-art super junction Si (Silicon) MOSFET (Metal oxide semiconductor field effect transistor), the FOM (Figure of merit) is much better because of heterojunction structure and wide band gap characteristics. However, designing the power conversion system with GaN HEMT is difficult due to its sensitive threshold voltage. The quite small parasitic capacitance makes it harder to design due to steep dv/dt and di/dt and design factor different from MOSFET as well. In this paper, the printed circuit board layout consideration is analyzed to realize effects of parasitic inductance of power and gate driver loop. In addition, the cause of the ZVS (Zero Voltage Switching) failure is mathematically analyzed as a result of mismatched deadtime. A 600 W phase shifted full bridge dc-dc converter is designed to evaluate effects of parasitic inductance and ZVS failure issues.
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