K. Hoshino, R. Satomi, T. Sudo, H. Okano, M. Ishikawa, H. Shibayama, H. Aoyagi, H. Kushibe, K. Yamagishi
{"title":"电源开关电流随片上电容变化的实验与仿真","authors":"K. Hoshino, R. Satomi, T. Sudo, H. Okano, M. Ishikawa, H. Shibayama, H. Aoyagi, H. Kushibe, K. Yamagishi","doi":"10.1109/EDAPS.2009.5403989","DOIUrl":null,"url":null,"abstract":"Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Experiment and simulation of power supply switching current dependency on on-chip capacitance\",\"authors\":\"K. Hoshino, R. Satomi, T. Sudo, H. Okano, M. Ishikawa, H. Shibayama, H. Aoyagi, H. Kushibe, K. Yamagishi\",\"doi\":\"10.1109/EDAPS.2009.5403989\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5403989\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5403989","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experiment and simulation of power supply switching current dependency on on-chip capacitance
Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.