MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer

On-chip computing platforms have bottlenecks including cost and physical limits of scaling transistors, communication bottleneck, energy efficiency and speed costs for memory. Three dimensional (3D) design, carbon nanotube materials, memristor based neuromorphic computing, and optical, RF and magneto-inductive (MI) wireless communication solutions are recently proposed. MI channels are non-radiative and non-interfering by forming coupled networks. They are future promising with capabilities of THz frequency, Tbit/s data rate, hundreds of zJ/bit and 109 W/mm2 communication and power transfer (PT) efficiencies, respectively. In addition, recently introduced network topology modulation (NTM) for MI channels provides network communication with low complexity, low latency and simultaneous wireless information and power transfer (SWIPT). In this article, unique advantages of THz MI channels, NTM design, nanoscale materials including graphene and single molecular magnets (SMMs), and 3D design are combined in a novel on-chip computing architecture denoted by MIComp by introducing fully efficient SWIPT for computing purposes. The system is theoretically modeled while the state space of the system obtained with nanoscale size coils and SMMs achieves 1010 to 1016 bits in each cycle and per mm3 volume of chip compared with the current transistor counts of on the orders of 109 per mm2. Furthermore, each MIComp cycle has ability to perform for multiple purposes consisting of computing operations, memory state implementations and on-chip communications. It promises a novel solution for communication, energy and space bottlenecks for on-chip computing design.