{"title":"用于芯片对芯片通信的光互连","authors":"M. Fields","doi":"10.1109/ECOC.2010.5621147","DOIUrl":null,"url":null,"abstract":"Large-scale routers, supercomputers and datacenters all have internal networks for chip-to-chip communications with bandwidth, density, and power requirements that can surpass the capabilities of copper solutions. We review current state-of-the-art technologies, such as Avago's MicroPOD parallel optical modules.","PeriodicalId":391144,"journal":{"name":"36th European Conference and Exhibition on Optical Communication","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":"{\"title\":\"Optical interconnects for chip-to-chip communications\",\"authors\":\"M. Fields\",\"doi\":\"10.1109/ECOC.2010.5621147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Large-scale routers, supercomputers and datacenters all have internal networks for chip-to-chip communications with bandwidth, density, and power requirements that can surpass the capabilities of copper solutions. We review current state-of-the-art technologies, such as Avago's MicroPOD parallel optical modules.\",\"PeriodicalId\":391144,\"journal\":{\"name\":\"36th European Conference and Exhibition on Optical Communication\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"23\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"36th European Conference and Exhibition on Optical Communication\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECOC.2010.5621147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"36th European Conference and Exhibition on Optical Communication","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECOC.2010.5621147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optical interconnects for chip-to-chip communications
Large-scale routers, supercomputers and datacenters all have internal networks for chip-to-chip communications with bandwidth, density, and power requirements that can surpass the capabilities of copper solutions. We review current state-of-the-art technologies, such as Avago's MicroPOD parallel optical modules.
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