微芯片上键垫变色的研究与消除

ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575) Pub Date : 2002-12-19 DOI:10.1109/SMELEC.2002.1217847

H. Younan, C. Eddy, S. Redkar

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引用次数: 3

摘要

本文讨论了一种粘结垫变色的情况。失效分析结果表明，键垫的变色是由针孔和针孔周围的硅粉引起的。这是在晶圆片模切过程中引入的由电偶腐蚀引起的。本文研究了铝键垫电偶腐蚀的失效机理和特征。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigation and elimination of discolored bondpads on microchip

In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.

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ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)

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