GaN hfet的温度依赖性导通损耗分析

E. Jones, Fred Wang, D. Costinett, Zheyu Zhang, Ben Guo
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引用次数: 36

摘要

增强型GaN hfet可以实现高效的高频转换器设计,但这种技术相对较新,并且与Si或SiC mosfet具有不同的特性。氮化镓在高温下的性能尤其独特。导通时间随温度显著增加,导通损耗随之增加。这种现象可以根据结温与GaN器件的跨导以及跨导与导通时间之间的关系来解释。本文推导了GaN公司650-V GS66508的温度与导通损耗的解析关系,并用实验结果进行了验证。基于这种关系,建立了一个详细的模型,并提出了一个简化的比例因子,用于估计e模GaN hfet的导通损耗,使用室温开关特性和通常公布的数据表参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature-dependent turn-on loss analysis for GaN HFETs
Enhancement-mode GaN HFETs enable efficient high-frequency converter design, but this technology is relatively new and exhibits different characteristics from Si or SiC MOSFETs. GaN performance at elevated temperature is especially unique. Turn-on time increases significantly with temperature, and turn-on losses increase as a result. This phenomenon can be explained based on the relationships between junction temperature and GaN device transconductance, and between transconductance and turn-on time. An analytical relationship between temperature and turn-on loss has been derived for the 650-V GS66508 from GaN Systems, and verified with experimental results. Based on this relationship, a detailed model is developed, and a simplified scaling factor is proposed for estimating turn-on loss in e-mode GaN HFETs, using room-temperature switching characterization and typically published datasheet parameters.
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