整体设备效率(OEE)和成本测量[半导体制造]

J. Konopka, W. Trybula
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引用次数: 23

摘要

全面生产维护(TPM)为半导体制造提供了一个新的视角。提高性能的需要比以往任何时候都需要更多地关注整体设备效率(OEE)的TPM指标。通过一个名为产能利用率瓶颈效率系统(CUBES)的生产率分析框架对这些数据进行调查,可以识别出生产率低下以及随之而来的工具产能下降,并对其进行优先级排序。讨论了扩展多维数据集以反映与这些低效率相关的成本测量的建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]
Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed.
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