{"title":"整体设备效率(OEE)和成本测量[半导体制造]","authors":"J. Konopka, W. Trybula","doi":"10.1109/IEMT.1996.559707","DOIUrl":null,"url":null,"abstract":"Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":"{\"title\":\"Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]\",\"authors\":\"J. Konopka, W. Trybula\",\"doi\":\"10.1109/IEMT.1996.559707\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed.\",\"PeriodicalId\":177653,\"journal\":{\"name\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"23\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1996.559707\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559707","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]
Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed.