J. Joseph, Lennart Bamberg, Sven Wrieden, Dominik Ermel, A. Ortiz, Thilo Pionteck
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引用次数: 2
摘要
新的3D生产方法使不同技术节点制造的模具能够异构集成。非对称3D互连架构(A-3D-IAs)是针对这些异构3D芯片系统(3D soc)的通信基础设施,其设计方法和设计工具仍然缺失。在这里,提出了一种设计方法,该方法遵循由高级模型支持的增量方法。因此,我们提出了第一个模拟器和设计框架,涵盖了A-3D-IAs的各种要求。这包括一个抽象模型,用于估计A-3D-IA中2D金属线和3D硅通孔(tsv)的应用特定能耗。结合电磁场求解器对TSV阵列等效电路的提取进行了电路仿真验证。该模型具有较高的抽象层次,可实现快速仿真。尽管如此,对于真实的数据流场景,它仍然显示出小于8%的最大误差。此外,还提出了一种数学描述,可以在高抽象水平上快速评估a - 3d - ia的低功耗编码方案。
Design method for asymmetric 3D interconnect architectures with high level models
New 3D production methods enable heterogeneous integration of dies manufactured in different technology nodes. Asymmetric 3D interconnect architectures (A-3D-IAs) are the communication infrastructure targeting these heterogeneous 3D system on chips (3D SoCs), for which design methodologies and design tools are still missing. Here, a design method is proposed following an incremental approach enabled by high level models. Therefore, we present the first simulator and design framework covering the diverse requirements of A-3D-IAs. This includes an abstract model to estimate the application specific energy consumption of 2D metal wires and 3D through silicon vias (TSVs) in an A-3D-IA. It is validated by circuit simulations in combination with an electromagnetic field solver which is used for the extraction of the TSV array equivalent circuit. The model lays on a high abstraction level for fast simulations. Nonetheless, for real data stream scenarios it still shows a small maximum error of less than 8%. Additionally, a mathematical description is presented which enables a fast evaluation of low power coding schemes for A-3D-IA on a high level of abstraction.