集成三维无线电前端系统-包(SOP)的开发

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) Pub Date : 2001-10-21 DOI:10.1109/GAAS.2001.964381

J. Laskar, A. Sutono, C. Lee, M.F. Davis, M. Maeng, N. Lal, K. Lim, S. Pinel, M. Tentzeris, A. Obatoyinbo

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引用次数: 31

摘要

本文介绍了紧凑、高集成度的微波和毫米波无线电前端系统包(SOP)的发展和特性。三维收发器前端SOP架构采用封装上集成的集总元件无源以及射频功能，主要是标准多层LTCC和全有机技术中的滤波器、平衡器和天线。演示了一种基于ltcc的14ghz卫星室外单元发射机，一种采用ku波段光子载波复用(OSCM)技术的OC-192发射机，以及全有机SOP传输线和集总元组件。这些原型表明开发高度小型化的具有成本效益的SOP收发器的可行性，不仅适用于无线，也适用于光电子链路。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of integrated 3D radio front-end system-on-package (SOP)

This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.

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来源期刊

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)

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