{"title":"CMOS缩放到25nm栅极长度","authors":"S. Kubicek, K. De Meyer","doi":"10.1109/ASDAM.2002.1088521","DOIUrl":null,"url":null,"abstract":"In this paper some of the device and process issues of scaling CMOS technology down to 25 nm gate lengths are reviewed. First scaling is discussed front a device perspective and the main device related issues are identified. An overview of the historical trends and predictions by the ITRS roadmap follows. Implications of the scaling predictions for the specific device process modules are reviewed and recent experimental data are presented.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"CMOS scaling to 25 nm gate lengths\",\"authors\":\"S. Kubicek, K. De Meyer\",\"doi\":\"10.1109/ASDAM.2002.1088521\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper some of the device and process issues of scaling CMOS technology down to 25 nm gate lengths are reviewed. First scaling is discussed front a device perspective and the main device related issues are identified. An overview of the historical trends and predictions by the ITRS roadmap follows. Implications of the scaling predictions for the specific device process modules are reviewed and recent experimental data are presented.\",\"PeriodicalId\":179900,\"journal\":{\"name\":\"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM.2002.1088521\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2002.1088521","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this paper some of the device and process issues of scaling CMOS technology down to 25 nm gate lengths are reviewed. First scaling is discussed front a device perspective and the main device related issues are identified. An overview of the historical trends and predictions by the ITRS roadmap follows. Implications of the scaling predictions for the specific device process modules are reviewed and recent experimental data are presented.