先进MMC子模块拓扑结构中减小电容器尺寸和On-State损耗

Christopher Dahmen, R. Marquardt
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引用次数: 2

摘要

高功率模块化多电平转换器(MMC)的进展对许多未来应用至关重要[1]-[5]。进一步降低功率损耗和减小转换器的占地面积需要先进的子模块拓扑结构,能够很好地适应sic功率半导体和MMC中的工作条件。这些措施的高潜力被调查和解释使用分析方法-提供一般的见解。数值结果,基于商业上可用的Si和sic模块,展示了与最先进的技术相比的基本改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reduced Capacitor Size and On-State Losses in Advanced MMC Submodule Topologies
Progress of high power Modular Multilevel Converters (MMC) is of prime importance for many future applications [1]–[5]. Further reduction of power losses and smaller foot-print of the converters requires advanced submodule topologies, well adapted to SiC-power semiconductors and the operating conditions in MMC. The high potential of these measures is investigated and explained using analytical methods – providing general insight. Numerical results, based on commercially available Si- and SiC-modules are presented, demonstrating the essential improvements compared to the state-of-the-art.
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