铝硒铜薄膜结构谐振隧道二极管

S. Arora, Y. Sharma, Y. K. Vijay
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引用次数: 0

摘要

利用真空镀膜装置热蒸发将铝硒铜薄膜布置在玻璃基板上。在玻璃基板上沉积了三层不同的材料。I层为铝,II层为硒,III层为铜。薄膜厚度约为~ 200nm。我们提出研究该薄膜的VI特性,描述了在不施加任何外部电压的情况下PN结将导致平衡状态的效应。当在n型和p型材料的两端进行电气连接,然后将它们连接到电池源时,它会使能量源克服势垒。Al-Se-Cu薄膜导致正向电流受多数载流子隧穿控制,开始出现负差分电阻,导致电子最大跃迁,导致电流减小到4-5 V的I-V曲线谷点,观察到负差分电阻为0.64*10欧姆。这代表了RTD(谐振隧穿二极管)结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Resonant Tunnelling Diode Using Al-Se-Cu Thin Film Structure
Al-Se-Cu thin film was arranged on a glass substrate by thermal evaporation using vacuum coating unit. Three layers of different material were deposited on Glass substrate. I layer is Aluminium, II Layer is Selenium and III layer is Cu. Thickness of film is about ~200 nm. We propose to study the VI Characteristics of this film, the effect described without applied any external voltage PN junction will results in state of equilibrium. When electrical connections has been applied at the ends of both the N-type and the P-type materials and then connect them to a battery source, it cause energy source to overcome the potential barrier. Al-Se-Cu film results in forward current is found to be controlled by majority carrier tunnelling and negative differential resistance starts appearing which results maximum transition of electrons and results in decrease in current up to 4-5 V valley point of I-V curve and negative differential resistance observed is 0.64*10 ohms. This represents RTD (Resonant tunnelling diode) Structure.
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