{"title":"使用2D机器视觉对表面贴装组件进行自动光学检查","authors":"Y. Watanabe","doi":"10.1109/IECON.1989.69697","DOIUrl":null,"url":null,"abstract":"An inspection system based on two-dimensional vision and the algorithms for inspecting various surface mount component defects are discussed. The surface mount postsolder inspection system described detects component polarity, shifted components, missing components, bridges, and the presence/absence of a solder fillet with an accuracy of 99.9%. Insufficient solder on a fillet can be detected with 99.5% accuracy.<<ETX>>","PeriodicalId":384081,"journal":{"name":"15th Annual Conference of IEEE Industrial Electronics Society","volume":"105 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Automated optical inspection of surface mount components using 2D machine vision\",\"authors\":\"Y. Watanabe\",\"doi\":\"10.1109/IECON.1989.69697\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An inspection system based on two-dimensional vision and the algorithms for inspecting various surface mount component defects are discussed. The surface mount postsolder inspection system described detects component polarity, shifted components, missing components, bridges, and the presence/absence of a solder fillet with an accuracy of 99.9%. Insufficient solder on a fillet can be detected with 99.5% accuracy.<<ETX>>\",\"PeriodicalId\":384081,\"journal\":{\"name\":\"15th Annual Conference of IEEE Industrial Electronics Society\",\"volume\":\"105 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"15th Annual Conference of IEEE Industrial Electronics Society\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON.1989.69697\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th Annual Conference of IEEE Industrial Electronics Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON.1989.69697","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated optical inspection of surface mount components using 2D machine vision
An inspection system based on two-dimensional vision and the algorithms for inspecting various surface mount component defects are discussed. The surface mount postsolder inspection system described detects component polarity, shifted components, missing components, bridges, and the presence/absence of a solder fillet with an accuracy of 99.9%. Insufficient solder on a fillet can be detected with 99.5% accuracy.<>