晶圆处理机器人模拟的取放算法的实现

Nikolay Bratovanov
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引用次数: 1

摘要

本文提出了一种基于三维CAD软件的高效拾取机器人仿真方法。针对硅片处理机器人,开发需要实现几种算法,其主要任务是确定机器人的末端执行器与硅片之间的接近程度,以及检查末端执行器的真空状态。因此,可以在完全虚拟的环境中执行、分析和评估与现实世界基板处理过程密切匹配的逼真对象操作。所提出的方法已成功地适用于基于SolidWorks API和Visual Basic的现有机器人模拟器。网络编程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Implementation of pick-and-place algorithms for the purposes of wafer handling robotics simulations
An approach for efficient pick-and-place robotics simulations based on 3D CAD software has been proposed in the paper. Oriented specifically towards wafer handling robots, the development requires the implementation of several algorithms, whose main tasks are associated with determining the proximity between the robot’s end-effector and the silicon wafers, as well as checking the end-effector’s vacuum state. As a result, realistic object manipulations, closely matching the real-world substrate handling process can be performed, analyzed and evaluated in a completely virtual environment. The proposed approach has been successfully adapted to an already existing robot simulator based on SolidWorks API and Visual Basic.NET programming.
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