电信集成电路用3-D可积光电子器件

2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315) Pub Date : 2002-08-07 DOI:10.1109/ISSCC.2002.993081

P. Dainesi, A. Ionescu, L. Thévenaz, K. Banerjee, M. Declercq, P. Robert, P. Renaud, P. Fluckiger, C. Hibert, G. Racine

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引用次数: 4

摘要

三维可积SOI光电子器件包括5 MHz带宽的通信光开关和用于滤波的非平衡马赫曾德尔干涉仪。热补偿提供了100 kHz -1 MHz以上的高效调制，解决了3-D集成电路的热问题。

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3-D integrable optoelectronic devices for telecommunications ICs

3-D integrable SOI optoelectronic devices include telecommunication optical switches with 5 MHz bandwidth and unbalanced Mach Zehnder interferometers for filtering. Thermal compensation provides efficient modulation over 100 kHz -1 MHz and addresses 3-D IC thermal issues.

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2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)

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