BTI和HCI应力器件寿命预测方法的新视角及其对电路寿命的影响

Min-Chul Park, G. Yang, Joon-Sung Yang, Keun-Ho Lee, Young-Kwan Park
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引用次数: 3

摘要

研究了多晶硅门控MOSFET的器件寿命和电路寿命。新发现有:(1)通过量化聚耗损效应(PDE)和累积陷阱电荷效应(ATCE)的影响,提高了1个量级以上的寿命。(2)我们证明了传统的寿命模型对快速和慢速方法测量的每个退化数据产生了不正确的和相反的寿命结果。(3)根据新发现评估了对电路参数、传播延迟时间(tPD)、退化的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New perspective on lifetime prediction approach for BTI and HCI stressed device and its impact on circuit lifetime
Device and circuit lifetime is investigated for poly silicon gated MOSFET. New findings are: (1) More than 1 order lifetime is increased by quantifying the influence of poly depletion effect (PDE) and accumulated trap charge effect (ATCE). (2) We demonstrate that conventional lifetime model produce an incorrect and reverse lifetime result for each degradation data measured by fast and slow method. (3) We evaluate the impact on circuit parameter, propagation delay time (tPD), degradation in the light of new findings.
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