超深亚微米CMOS数字设计的扩展sakurai - newton MOSFET模型

N. Chandra, Apoorva Kumar Yati, A. Bhattacharyya
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引用次数: 19

摘要

本文提出了Sakurai-Newton n次幂律模型的一个扩展,即Extended-Sakurai-Newton模型。所提出的模型(以下称为ESN模型)保留了Sakurai Newton模型用于估计深亚微米CMOS器件漏极电流的简便性和准确性,并将其扩展到不同的器件宽度。虽然改进的Sakurai-Newton电流模型(MSN模型)也提供了晶体管漏极电流随晶体管宽度变化的估计,但其缺点是在参数提取方面更容易出错,计算量大。所提出的模型与BSIM3v3级49 T-SPICE模拟相匹配,在0.18µm和0.25µm CMOS工艺中,对于宽范围的晶体管宽度和输入上升/下降时间,误差在1.8%(最大3.67%)以内。该模型进一步用于改进低电源电压下CMOS逆变器的Elmore延迟预测。在此基础上改进了基于电流质心和功率的时延指标[1]。新的延迟度量能够准确地预测CMOS逆变器在低电源电压下的延迟。所提出的回声状态网络模型也被用于预测双输入CMOS NAND门的延迟。因此,所提出的模型可以有效地用于设计涉及器件宽度和电源电压在深亚微米区域变化的数字CMOS门。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extended-Sakurai-Newton MOSFET Model for Ultra-Deep-Submicrometer CMOS Digital Design
In this paper an extension of the Sakurai and Newton's Nth power law model, namely Extended-Sakurai-Newton Model, is proposed. The proposed model (henceforth referred to as the ESN model) preserves the simplicity and accuracy of the Sakurai Newton model for the estimation of drain current in deep submicron CMOS devices and extends it for varying device widths. Although the Modified Sakurai-Newton Current Model (MSN Model) also provides an estimation of transistor drain current with varying transistor widths, it suffers from the drawback of being more error prone and computation intensive in parameter extraction. The proposed model matches with BSIM3v3 level 49 T-SPICE simulations to within an error of 1.8%(3.67% maximum), in 0.18µm and 0.25µm CMOS processes for a wide range of transistor widths and input rise/fall times. The proposed model is further used to improve the Elmore Delay prediction of CMOS inverter operated at low supply voltages. The centroid-of-current and power based delay metrics [1] are modified based on the proposed model. The new delay metric is able to accurately predict the delay of CMOS inverter operated at low supply voltages. The proposed ESN Model is also applied to predict the delay of two-input CMOS NAND gate. Hence the proposed model can be effectively used in the design of digital CMOS gates involving varying device widths and supply voltages in the deep submicron region.
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