一种基于异质BGA器件的SiP微波模块封装封装方法

2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Pub Date : 2022-08-12 DOI:10.1109/ICMMT55580.2022.10023426

Ruhao Sun, Cheng-long Wang, Wei Wei, Lu Xie, Bingcheng Mao

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引用次数: 0

摘要

系统内封装(SiP)技术为微波模块提高封装密度和集成度提供了新的发展方向。本文设计了基于异质球栅阵列的SiP微波模块封装对封装(PoP)组装工艺流程。提出了连接合金球、模板、温度等参数。对堆垛质量、互连精度和强度进行了检验。该方法可用于生产18GHz以下的PoP微波模块。

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A Package on Package Assembly Method of SiP Microwave Module based on Heteroid BGA Devices

System in package (SiP) technology provides new development for microwave modules of improving package density and integration level. In this paper, the process flow of package-on-package (PoP) assembly of SiP microwave module based on heteroid ball grid array is designed. The parameters of interconnected alloy balls, stencil and temperature are proposed. The stacking quality, accuracy and strength of interconnections are inspected. The method can be applied in manufacturing PoP microwave modules below 18GHz.

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2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

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