在倒装芯片增强QFN封装中表征WR5波段集成天线辐射方向图的方法

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2022-10-09 DOI:10.1109/EPEPS53828.2022.9947116

Aditya N. Jogalekar, Oscar F. Medina, A. Blanchard, R. Henderson, M. Iyer, Hassan Ali, R. Murugan, Tony Tang

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引用次数: 2

摘要

集成在封装中的毫米波(mmWave)天线的辐射方向图测量由于其小型化的尺寸、可用的馈电方法和封装固有的结构限制而面临一些挑战，需要创新的解决方案。本文讨论了两种新的方法来馈送在倒装芯片增强QFN (FCeQFN)内制作的宽带天线，使用频率范围为140GHz至220GHz的标准波导。这两种方法分别实现41.25%和100%的- 10dB带宽，最大衰减分别为3dB和3.34dB，从而支持所提出的天线表征方法。此外，我们还讨论了这些转换的性能比较及其实现可行性。简要介绍了一种槽形领结天线的测量结构和天线辐射方向图分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Methods to Characterize Radiation Patterns of WR5 Band Integrated Antennas in a Flip-Chip Enhanced QFN Package

Radiation pattern measurements of a millimeter wave (mmWave) antenna integrated in a package possesses several challenges due to its miniaturized size, available feeding methods, and inherent structural limitations of the package that calls for an innovative solution. This paper discusses two novel approaches to feed a wideband antenna fabricated inside a flip-chip enhanced QFN (FCeQFN) using a standard waveguide in the frequency range of 140GHz to 220GHz. The two approaches support the proposed antenna characterization methodology by achieving a 41.25% and 100% of −10dB bandwidth with a maximum attenuation of 3dB and 3.34dB, respectively. Further, we discuss the performance comparison of these transitions along with their implementation feasibility. A brief description of measurement structures and antenna radiation pattern analysis for a slot bow-tie antenna is reported.

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来源期刊

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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