Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain
{"title":"势垒厚度变化对栅极工程TM-DG异质结构MOSFET抑制SCE及其SOC应用模拟、射频、线性性能的影响","authors":"Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain","doi":"10.1109/EDKCON.2018.8770475","DOIUrl":null,"url":null,"abstract":"In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (g<inf>m</inf>), Output resistance (R<inf>OUT</inf>), Intrinsic Gain (g<inf>m</inf>R<inf>out</inf>), Transconductance Generation factor (g<inf>m</inf>/I<inf>D</inf>), gate capacitance, cutoff frequency(f<inf>T</inf>), maximum frequency of oscillation (f<inf>max</inf>), Gain Bandwidth Product (GBW), VIP2, VIP<inf>3</inf>and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.","PeriodicalId":344143,"journal":{"name":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","volume":"183 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Variation in Barrier Thickness on a Gate-Engineered TM-DG Heterostructure MOSFET to Suppress SCE's and it's Analog, RF, Linearity Performance Investigation for SOC Applications\",\"authors\":\"Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain\",\"doi\":\"10.1109/EDKCON.2018.8770475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (g<inf>m</inf>), Output resistance (R<inf>OUT</inf>), Intrinsic Gain (g<inf>m</inf>R<inf>out</inf>), Transconductance Generation factor (g<inf>m</inf>/I<inf>D</inf>), gate capacitance, cutoff frequency(f<inf>T</inf>), maximum frequency of oscillation (f<inf>max</inf>), Gain Bandwidth Product (GBW), VIP2, VIP<inf>3</inf>and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.\",\"PeriodicalId\":344143,\"journal\":{\"name\":\"2018 IEEE Electron Devices Kolkata Conference (EDKCON)\",\"volume\":\"183 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Electron Devices Kolkata Conference (EDKCON)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDKCON.2018.8770475\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDKCON.2018.8770475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of Variation in Barrier Thickness on a Gate-Engineered TM-DG Heterostructure MOSFET to Suppress SCE's and it's Analog, RF, Linearity Performance Investigation for SOC Applications
In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (gm), Output resistance (ROUT), Intrinsic Gain (gmRout), Transconductance Generation factor (gm/ID), gate capacitance, cutoff frequency(fT), maximum frequency of oscillation (fmax), Gain Bandwidth Product (GBW), VIP2, VIP3and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.