势垒厚度变化对栅极工程TM-DG异质结构MOSFET抑制SCE及其SOC应用模拟、射频、线性性能的影响

Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain
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引用次数: 0

摘要

在本工作中,考虑到改变势垒层厚度的影响,对Gate-Engineered TM-DG异质结构MOSFET进行了直流、模拟、射频、线性和SCE参数分析。通过评估跨导(gm)、输出电阻(ROUT)、固有增益(gmRout)、跨导产生因子(gm/ID)、栅极电容、截止频率(fT)、最大振荡频率(fmax)、增益带宽积(GBW)、VIP2、vip3和1db压缩等标准优点图(FOMs)来研究该器件的性能。通过TCAD模拟,将势垒厚度从1 nm改变到4 nm,分析了所有这些FOMs。仿真结果表明:TM-DG异质结构金属场效应晶体管(1:2:3)的性能随着势垒厚度的减小而受到影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Variation in Barrier Thickness on a Gate-Engineered TM-DG Heterostructure MOSFET to Suppress SCE's and it's Analog, RF, Linearity Performance Investigation for SOC Applications
In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (gm), Output resistance (ROUT), Intrinsic Gain (gmRout), Transconductance Generation factor (gm/ID), gate capacitance, cutoff frequency(fT), maximum frequency of oscillation (fmax), Gain Bandwidth Product (GBW), VIP2, VIP3and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.
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