手工焊接过程中对IC封装的热影响

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887562

A. Fodor, R. Jano, D. Pitica

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引用次数: 0

摘要

提出的工作调查了手工焊接过程，以及热现象如何影响不同的集成电路，这取决于它们的形式。该研究主要针对表面贴装器件，因为组装技术涉及与烙铁直接接触。使用SolidWorks Flow Simulation工具进行了模拟，随后使用热像仪进行了实际实验，以便准确了解手动焊接的过程。

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Thermal influences on IC packages during manual soldering process

The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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