用于光纤演示系统的40gb /s, 3伏InP HBT集成电路

GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996 Pub Date : 1996-11-03 DOI:10.1109/GAAS.1996.567822

T. Swahn, T. Lewin, M. Mokhtari, H. Tenhunen, R. Walden, W. Stanchina

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引用次数: 9

摘要

我们设计并制造了用于40gb /s光纤演示系统的InP HBT芯片组。该芯片组由14种不同的数字和模拟集成电路组成，该项目是爱立信微波系统AB公司和休斯研究实验室的合资企业。该项目的目标是演示40 Gb/s光纤操作，学习如何设计超高速/高频集成电路，并扩展我们在电路行为预测方面的知识。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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40 Gb/s, 3 volt InP HBT ICs for a fiber optic demonstrator system

We have designed and fabricated an InP HBT chip set intended for a 40 Gb/s fiber optic demonstrator system. The chip set consists of 14 different digital- and analog-ICs, and the project is a joint-venture between Ericsson Microwave Systems AB and Hughes Research Laboratories. The project goal is to demonstrate 40 Gb/s fiber optical operation, to learn how to design very high speed/high frequency integrated circuits, and to expand our knowledge on circuit behaviour prediction.

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来源期刊

GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996

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