去耦电容安装电感的评估与比较

Benoît Goral, C. Gautier, A. Amédéo
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引用次数: 0

摘要

在这篇文章中,比较了在一个专用测试车上不同的去耦电容路由模式。本研究的目的一方面是确认印刷电路板上增强去耦的设计规则,另一方面是估计每个图案引入的安装电感的值。将描述每种安装模式和每种情况下研究的特定参数,并介绍安装电感计算的测量方法。然后,将测量所得的安装电感值与仿真所得的结果进行了比较,比较了近年来专用于印刷电路板的混合电磁求解器在计算寄生元件时所达到的精度。最后给出了更好解耦的设计规则和权衡作为结论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation and comparison of mounted inductance for decoupling capacitor
In this article, different patterns for decoupling capacitor routed on a dedicated test vehicle are compared. The aim of this study is, on one hand to confirm design rules for enhanced decoupling on printed circuit board and on the other hand, to estimate the value of the mounted inductance introduced by each pattern. Each mounting pattern and the particular parameter which is studied for each case will be described and measurement methodology as mounted inductance calculation will be presented. Then, mounted inductance calculated from measurement and results given by simulation are compared in order to see the precision reached by recent hybrid EM solver dedicated to Printed Circuit Board for parasitic elements calculation. Finally design rules and trade off for better decoupling are given as a conclusion.
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