回流焊方法对电容器寿命的影响

R. Jano, D. Pitica, P. Svasta, G. Vărzaru
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引用次数: 3

摘要

研究了不同的焊接方法和特定的热分布对通孔电容器寿命的影响。采用气相或红外对流等替代波峰焊工艺,对铝电解、陶瓷和两种电容器类型与不同塑料介质电容器的性能进行了评估。监测了焊接前后电容器的电容值和ESR值的变化,并评估了不同工艺对电容器寿命的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of reflow soldering methods on the lifetime of capacitors
The influences of different soldering methods and specific thermal profiles were investigated on the lifetime of through hole capacitors. The behavior of aluminum electrolytic, ceramic and two capacitor types with different plastic dielectric capacitors were evaluated when using alternative soldering methods instead of the standard wave soldering process, such as vapour phase or infrared convection. The changes in the values of capacitance and ESR of the capacitors were monitored before and after soldering and the influence of the different techniques on their lifetimes was assessed.
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