A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects

In this contribution, the resistance and inductance of 3-D interconnects are obtained through a full-wave approach. By solving a free space boundary integral equation (BIE) combined with a fully 3-D differential surface admittance operator in a circuit framework, an effective procedure to study finite conductivity interconnects is presented. The accuracy of the proposed method in characterizing 3-D interconnects is demonstrated through an on-board and an on-chip example.