采用全无触点测量法检测模具贴片质量

2006 IEEE Design and Diagnostics of Electronic Circuits and systems Pub Date : 2006-04-18 DOI:10.1109/DDECS.2006.1649578

G. Bognár, Gyula Horváth, Z. Szűcs, V. Székely

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引用次数: 0

摘要

本文提出了一种新颖的、完全无接触的方法，通过测量由热膨胀引起的膨胀来检测半导体器件的贴片问题。采用激光干涉仪测量系统，测量了红外辐射对被测结构产生的热膨胀。采用基于触控笔的测量方法，对之前得到的结果进行了交叉验证

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Die attach quality testing by fully contact-less measurement method

The paper presents a novel, fully contact-less method for detecting die attach problems of semiconductor devices by measuring the dilatation resulting from thermal expansion. Laser interferometer measuring system was used to measure the thermal dilatation caused by infrared radiation directed onto the measured structure. By using the contact based stylus measurement method the previously got results have been cross-verified

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2006 IEEE Design and Diagnostics of Electronic Circuits and systems

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