{"title":"电子封装-一个基于网络的课程，为IEEE社区","authors":"M. Caggiano, K. M. Ho","doi":"10.1109/ECTC.2002.1008307","DOIUrl":null,"url":null,"abstract":"The authors profile a course that is a Web-based enhancement of a new graduate. course entitled \"Electronics Packaging\" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electronics packaging - a Web-based course for the IEEE community\",\"authors\":\"M. Caggiano, K. M. Ho\",\"doi\":\"10.1109/ECTC.2002.1008307\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors profile a course that is a Web-based enhancement of a new graduate. course entitled \\\"Electronics Packaging\\\" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008307\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008307","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electronics packaging - a Web-based course for the IEEE community
The authors profile a course that is a Web-based enhancement of a new graduate. course entitled "Electronics Packaging" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.
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