HBT外延材料的技术与生产

1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest Pub Date : 1997-02-23 DOI:10.1109/MTTTWA.1997.595126

D. Streit, A. Oki, T. Block, D. Lammert, M. Hoppe, D. Umemoto, M. Wojtowicz

{"title":"HBT外延材料的技术与生产","authors":"D. Streit, A. Oki, T. Block, D. Lammert, M. Hoppe, D. Umemoto, M. Wojtowicz","doi":"10.1109/MTTTWA.1997.595126","DOIUrl":null,"url":null,"abstract":"We report sustained high-yield, high-volume production of HBT epitaxial material and devices for commercial applications. We also report the use of nondestructive material characterization to predict the performance of the fabricated devices.","PeriodicalId":264044,"journal":{"name":"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Technology and production of HBT epitaxial material\",\"authors\":\"D. Streit, A. Oki, T. Block, D. Lammert, M. Hoppe, D. Umemoto, M. Wojtowicz\",\"doi\":\"10.1109/MTTTWA.1997.595126\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report sustained high-yield, high-volume production of HBT epitaxial material and devices for commercial applications. We also report the use of nondestructive material characterization to predict the performance of the fabricated devices.\",\"PeriodicalId\":264044,\"journal\":{\"name\":\"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest\",\"volume\":\"73 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-02-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MTTTWA.1997.595126\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MTTTWA.1997.595126","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

我们报告了用于商业应用的HBT外延材料和器件的持续高产、大批量生产。我们还报告了使用无损材料表征来预测制造器件的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Technology and production of HBT epitaxial material

We report sustained high-yield, high-volume production of HBT epitaxial material and devices for commercial applications. We also report the use of nondestructive material characterization to predict the performance of the fabricated devices.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest

自引率

0.00%

发文量