绿色电子互连的可靠性建模

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290868

C. Bailey, H. Lu, C. Yin, S. Stoyanov

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引用次数: 1

摘要

无铅互连材料和其他环保材料的采用引起了电子封装制造商的许多关注。本文讨论了利用计算机模型研究无铅焊料、各向异性导电胶膜和各向同性胶粘剂互连的倒装芯片可靠性的方法和结果。结果表明，利用目前可用的材料数据和计算机建模技术，可以预测许多有用的可靠性趋势，其结果可用于改进初始产品设计和加快材料截面加工过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modelling the reliability of green electronic interconnects

The adoption of lead-free interconnection materials and other environmentally friendly materials is causing a number of concerns for electronic package manufacturers. In this paper the methodology and results of using computer modelling to study the reliability of flip chips with lead-free solder, anisotropic conductive adhesive films and isotropic adhesives interconnects are discussed. It is shown that with currently available material data and computer modelling techniques many useful trends in reliability can be predicted and the results can be used to improve the initial product design and speed up the material section process.

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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