I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo
{"title":"用于WiNoC应用的Ka波段硅上集成偶极子天线和传播通道","authors":"I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo","doi":"10.1109/SAPIW.2018.8401659","DOIUrl":null,"url":null,"abstract":"This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Integrated dipole antennas and propagation channel on silicon in Ka band for WiNoC applications\",\"authors\":\"I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo\",\"doi\":\"10.1109/SAPIW.2018.8401659\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.\",\"PeriodicalId\":423850,\"journal\":{\"name\":\"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"88 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SAPIW.2018.8401659\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAPIW.2018.8401659","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated dipole antennas and propagation channel on silicon in Ka band for WiNoC applications
This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.